Thermal Analysis and Rheology Tests for Characterizing Adhesives and Bonded Joints
The analysis of adhesives and adhesively bonded joints is very important for the development of bonded joints, for designing specific dosing and application processes, and for quality assurance and damage/failure analysis.
In the adhesive selection phase for new product developments, Fraunhofer IFAM carries out thermal analysis and rheology tests for customers on adhesives, sealants and potting compounds. The measurement data far exceeds the data delivered by manufacturer’s material data sheets, thus allowing for an objective and neutral comparison of products. Regarding adhesive qualification for specific applications, the subsequently mentioned analytical methods help to minimize the number of component prototypes that have to be built.
The selection of the analytical methods to be used and expert interpretation of the analytical data by Fraunhofer IFAM specialists are the key factors for the quality of the final product.
- Various rotational rheometers and capillary rheometers for characterizing the flow and deformation properties
- Dynamic mechanical analysis (DMA)
- Thermal mechanical analysis (TMA)
- Differential scanning calorimetry (DSC)
- Thermogravimetric analysis (TGA), including the coupling with mass spectrometry (TGA-MS)
- Thermal conductivity measurement (laser flash method)
- Moisture determination in polymers
- Testing the adhesion to different surfaces in accordance with DIN standards
- Infrared spectroscopy (IR) and Raman spectroscopy
- Accelerated aging tests