STRESSES IN THE BOND LINE AFTER ADHESIVE CURING - CAUSE AND EFFECT | The most common causes of stresses in bond lines during adhesive curing are the volume reduction of the adhesive due to curing and different thermal expansions of the adhesive and the joined parts or of two different joined parts. When designing adhesive bonds, the question of volume reduction, also known as curing shrinkage, is crucial. It is important to determine the material value and understand how much volume reduction actually causes stress.
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Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM