Nuremberg  /  June 09, 2026  -  June 11, 2026

PCIM 2026

The world's leading trade fair and conference for power electronics and its applications

PCIM 2026

At PCIM 2026, Fraunhofer IFAM Dresden will be represented alongside Fraunhofer IWU, Fraunhofer IMWS, Fraunhofer USA, and an industry partner in Hall 5, 𝗦𝘁𝗮𝗻𝗱 𝟮𝟬𝟮. We will demonstrate what is possible in the field of high-performance cooling for electronics—from AI chips to sensors.

In addition, we are hosting a 𝗳𝗿𝗲𝗲 𝗶𝗻𝗱𝘂𝘀𝘁𝗿𝘆 𝘄𝗼𝗿𝗸𝘀𝗵𝗼𝗽 on the topic of “High-Performance Cooling for High-Performance Electronics”:

AI chips and other high-power components generate significant heat. We’ll show you how to manage this—from thermal simulation and characterization to real-world, industry-ready cooling solutions.

𝗪𝗵𝗲𝗿𝗲/𝗪𝗵𝗲𝗻: Room Lissabon (NürnbergConvention Center Mitte), 10 June, starting at 10:00 a.m.

Participation is free of charge.

Workshop Agenda

10:00 Welcome Note
10:15 Keynote: “Cooling high power density electronics: Which possibilities and strategies do we have?”
Eckart Höhne, Fraunhofer IZM
10:40 Industrial perspective: "What Physics Actually Wants: Physics-Driven Generative Design for Thermal Management”
Antonio Di Carentino, ToffeeX
11:00 “Optimization of heat sinks for maximal efficiency”
Thomas Menrath, Fraunhofer IISB
11:20 “Diamond-based technologies for active device and thermal cooling integration”
Matthias Mühle, Fraunhofer USA
11:40 ”Characterization of diamond membranes for integration in power electronics”
Andreas Graff, Fraunhofer IMWS
12:00 Break / discussions
13:00 Keynote: “Industrial high performance cooling solutions from small series to mass production”
Dennis Wawoczny, GKN Powder Metallurgy
13:20 “Shaping High-Thermal-Conductivity Copper–Diamond into complex structures”
Thomas Hutsch, Fraunhofer IFAM
13:40 „How Electronic Components Stay Cool for a Lifetime - Metallic Interconnection Technologies Between Electronic Modules and Heatsinks“
Olaf Römer, Fraunhofer IZM
14:00 Roundtable discussions