As artificial intelligence, power electronics and high-performance computing continue to drive increasing power densities, efficient thermal management becomes a key enabler for reliable and sustainable electronic systems. The workshop “New approaches for cooling of high-performance electronics” will thus highlight innovative approaches and practical solutions for high-performance cooling technologies used in demanding applications such as AI chips and advanced electronic systems.

Anyone interested is welcome to participate on 10 June 2026 from 10:00 a.m. in Room   Lisbon, NCC Ost at the Nuremberg Messe exhibition center.
Participation is free of charge.

Attendees can expect a comprehensive program covering:

• innovative research approaches,
• simulation and modelling methods,
• real-world industrial cooling solutions,
• and advanced characterization techniques

The workshop combines perspectives from applied research and industry, creating a platform for exchange between developers, manufacturers and users of thermal management technologies.

In addition to technical presentations and discussions, participants are invited to network with experts from research and industry in an informal atmosphere. Complimentary drinks and snacks will be provided.

Visitors are also invited to meet the Fraunhofer IFAM team throughout PCIM Expo 2026 in Hall 5, Booth 202. Together with their partners from Fraunhofer IMWS, Fraunhofer IWU, Fraunhofer USA and ToffeeX, they highlight latest research activities and developments.
 

Workshop Details

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• Date: 10 June 2026
• Time: from 10:00 a.m.
• Location: Room Lisbon, NCC Ost, Nuremberg Messe
• Organizer: Fraunhofer IFAM, Fraunhofer IMWS and Fraunhofer USA
• Participation: free of charge

Further information on Additive Manufacturing at Fraunhofer IFAM Dresden.