Additive Screen Printing

Additive Manufacturing with Additive Screen Printing

Watch the Additive Screen Printing Process at Fraunhofer IFAM Dresden.

Current activities and range of services

  • Development of material-specific paste systems and their heat treatment
  • Component design including strain simulation
  • Manufacture of demonstrators and small series
  • Economic efficiency calculations
  • Process transfer to end customers

Process description

Fraunhofer IFAM Dresden has developed an innovative and mass-market-ready process that enables the production of high volumes of precision metal components. To manufacture the components, a particle-filled slurry is transferred through a structured tool (screen) and then dried. This printing process is repeated until the target height of the component is reached or the geometry to be printed is changed by changing the screen. Two printing systems are available for the production of the components. After the printing process, the component is compacted using thermal processes (debinding + sintering).

Am Fraunhofer IFAM Dresden vorhandene Anlagentechnik für den additiven Siebdruck. Links: Exentis EX 251, rechts: EKRA XH2
Additive screen printing equipment available at Fraunhofer IFAM Dresden. Left: Exentis EX 251 Right: EKRA XH2

At a glance

Siebgedrucktes Stator- und Rotorblech einer permanent erregten Synchronmaschine gesintert
© Fraunhofer IFAM Dresden
Fe6.5Si stator/rotor sheet metal for electric drives
  • 2.5D geometries with dimensions up to 250 mm in diameter
  • High structuring resolution (wall thicknesses > 50 µm)
  • No post-processing of components necessary (Ra = 2 to 4 µm)
  • High reproducibility (tolerances comparable to metal injection moulding)
  • Material freedom (e.g. Fe-based, Co-based, Cu-based, soft magnetic materials, refractory metals, ceramics)
  • Multi-material components possible (e.g. soft magnetic-amagnetic; soft magnetic-insulating)
Im Siebdruckverfahren hergestellte Hochfrequenzfilter in Groove Gap Waveguide-Architektur für das WR10 Band
© Fraunhofer IFAM Dresden
High-frequency filter for satellite communication in grooved gap waveguide architecture (material: tungsten-copper)
Kühlkörper für die Anwendung in KI Chips (Werkstoff: 316L)
© Fraunhofer IFAM Dresden
Heat sink for use in AI chips (material: 316L)
Gradierte poröse Elektroden (Schäume+Siebdruck)  für die Wasserelektrolyse (Werkstoff: Nickel)
© Fraunhofer IFAM Dresden
Graded porous electrodes (foams + screen printing) for water electrolysis (material: nickel)